作废 SJ/T 11171-1998
无金属化孔单双面碳膜印制板规范 无金属化孔单双面碳膜印制板规范 Specification for single and double sided carbon-coated printed boards without interlayer connection
发布日期:1998-03-11
实施日期:1998-05-01
分类信息
研制信息

起草单位: 杭州宝临印制电路有限公司

起草人: 陈进军、 邵家根、 徐登玉、 童晓明、 朱民

标准简介

本标准规定了无金属化孔的单、双面碳膜印制板在安装元器件前的要求、试验方法、检验规则、标志、包装、运输和贮存。 本标准适用于在刚性无金属化孔单、双面印制板表面上用碳质导电印料制作一层或多层碳膜导电图形的印制板

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最后更新时间 2025-08-30