QJ 831B-2011
航天用多层印制电路板通用规范
General specification for multilayer printed board for aerospace
2011-07-19
QJ 832B-2011
航天用多层印制电路板试验方法
Test method of multilayer printed board for aerospace
2011-07-19
QJ 201A-1999
印制电路板通用规范
1999-02-14
T/ZZB 2922-2022
汽车电子安全件用多层印制电路板
2022-12-08
QJ 201B-2012
航天用刚性单双面印制电路板规范
Specification for rigid single-sided and double-sided printed circuit board of aerospace
2013-01-04
T/CPCA 4405-2020
印制电路板用硬质合金铣刀通用规范
2020-01-10
QJ 3113-1999
多层印制电路板用粘结片复验规则和方法
1999-04-02
T/CPCA 6047-2023
数据中心用刚性印制电路板规范
2023-09-28
MIL MIL-DTL-55302/111B
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE SOCKET CONTACTS, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING)(SUPERSEDING MIL-C-55302/111A)
印制电路组件和附件连接器:多层印制电路板用直通插座触点（.100间距）（取代MIL-C-55302/111A）
2006-05-22
T/CIE 223-2024
绿色计算机用可降解刚性印制电路板规范
2024-05-24
MIL MIL-C-55302/112 Notice 1-Cancellation
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PINS, RIGHT-ANGLE, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 INCH CONTACT SPACING) (112 CONTACTS, SPECIAL) (NO S/S DOCUMENT)
印制电路组件和附件连接器:多层印制电路板用直角插脚（.100英寸触点间距）（112个触点 特殊）（无S/S文件）
1979-09-07
MIL MIL-C-55302/48 Notice 1-Cancellation
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: SOCKET, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 INCH CONTACT SPACING) (56 AND 112 CONTACTS) (NO S/S DOCUMENT)
印制电路组件和附件连接器:多层印制电路板用直通插座（.100英寸触点间距）（56和112触点）（无S/S文件）
1979-09-07
MIL MIL-DTL-55302/22F
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING) (SUPERSEDING MIL-C-55302/22E)
印制电路组件和附件连接器:多层印制电路板用直通插座、插座触点（.100间距）（取代MIL-C-55302/22E）
2004-03-24
MIL MIL-DTL-55302/76D
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, SOCKET STRAIGHT-THRU, POLARIZED FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING) (SEE BASE FOR INACTIVATION NOTICE) (SUPERSEDING MIL-C-55302/76C)
多层印制电路板用极化直通插座（间距为（.100）印制电路组件和附件连接器（参见基底灭活通知）（取代MIL-C-55302/76C）
2004-11-12
MIL MIL-P-50884D Notice 2-Amendment 2
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884C)
挠性或硬挠性印制电路板通用规范（代替MIL-P-50884C）
2006-05-29
MIL MIL-DTL-55302/77D
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, PIN, RIGHT ANGLE, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING) (SEE BASE FOR INACTIVATION NOTICE) (SUPERSEDING MIL-C-55302/77C)
多层印制电路板用直角插针式印制电路组件和附件连接器（.100间距）（参见基底灭活通知）（取代MIL-C-55302/77C）
2004-11-12
UNE 20620-3-1-1981
METAL-CLAS BASE MATERIALS FOR PRINTED CIRCUITS. SPECIAL MATERIALS. SPECIFICATION NO.1: PRE-PREG FOR MULTILAYER PRINTED BOARDS
印刷电路板用金属覆层基材 特殊材料 规范1:多层印制板的预浸
1981-12-15
NASA RP 1161
EVALUATION OF MULTILAYER PRINTED WIRING BOARDS BY METALLOGRAPHIC TECHNIQUES - AN ILLUSTRATED GUIDE TO THE PREPARATION & INSPECTION OF PLATED-THROUGH HOLE TEST COUPONS BASED ON THE REQUIREMENTS OF MIL-P-55110D
用金相技术评估多层印制电路板——根据MIL-P-55110D要求制备和检查电镀通孔试样的图解指南
1986-05-01
MIL MIL-C-55302/22E
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING-BOARDS (.100 SPACING) (SUPERSEDING MIL-C-55302/22D) (S/S BY MIL-DTL-55302/22F)
印制电路组件和附件连接器:多层印制电路板用直通插座、插座触点（.100间距）（取代MIL-C-55302/22D）（S/S由MIL-DTL-55302/22F提供）
1979-12-12
KS C IEC 60249-2-11(2017 Confirm)
인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板
2002-08-31