DIN 45635-1651
Measurement of airborne noise emitted by machines; enveloping surface method; woodworking machines; single blade circular saw benches
测量机器发出的空气噪声；包络面法；木工机械；单刃圆锯台
1990-01-01
GOST 30762-2001
Изделия огнеупорные. Методы измерений геометрических размеров, дефектов формы и поверхностей
耐火产品 测量几何尺寸 形状和表面缺陷的方法
2001-11-01
DIN 45635-1657
Measurement of airborne noise emitted by machines; enveloping surface method; woodworking machines; double dimensions circular sawing machines
测量机器发出的空气噪声；包络面法；木工机械；双尺寸圆锯机
1983-08-01
KS L ISO 12678-2(2018 Confirm)
내화 제품 — 내화벽돌의 치수 및 외부 결함 측정–제2부: 모서리, 가장자리 및 그 밖의 표면 결함
耐火产品 - 耐火砖的尺寸和外部缺陷的测量 - 第2部分:拐角和边缘缺陷以及其他表面缺陷
2013-12-19
KS L ISO 12678-2(2023 Confirm)
내화 제품 — 내화벽돌의 치수 및 외부 결함 측정–제2부: 모서리, 가장자리 및 그 밖의 표면 결함
耐火产品耐火砖尺寸和外部缺陷的测量第2部分:角部和边缘缺陷及其他表面缺陷
2013-12-19
ISO 12678-2-1996
Refractory products — Measurement of dimensions and external defects of refractory bricks — Part 2: Corner and edge defects and other surface imperfections
耐火制品——耐火砖尺寸和外部缺陷的测量第2部分:角部和边缘缺陷及其他表面缺陷
1996-07-18
BS 1902-3.13-1996
Methods of testing refractory materials. General and textural properties-Measurement of dimensions and external defects of refractory bricks. Corner and edge defects and other surface imperfections
耐火材料的试验方法 一般特性和纹理特性 耐火砖尺寸和外部缺陷的测量 角部和边缘缺陷及其他表面缺陷
1996-11-15
BS EN 60191-6-21-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化
2010-12-31
BS EN 60191-6-4-2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2003-08-04
BS EN 60191-6-20-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化
2010-12-31
GB/T 15879.604-2023
半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
2023-05-23
IEC 60191-6-21-2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法
2010-08-30
IEC 60191-6-3-2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
半导体器件的机械标准化.第6-3部分:表面安装半导体器件封装外形图绘制的一般规则.方形扁平封装（QFP）封装尺寸的测量方法
2000-09-29
IEC 60191-6-4-2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 - 第6-4部分:表面贴装半导体器件封装外形图的一般规则 - 球栅阵列封装尺寸测量方法（bga）
2003-06-11
IEC 60191-6-20-2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法
2010-08-30
BS 08/30190030 DC
BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
英国标准EN 60191-6-21 半导体器件的机械标准化 第6-21部分 表面安装半导体器件封装外形图绘制的一般规则 小外形包装的包装尺寸测量方法（SOP）
2008-12-01
BS 08/30190026 DC
BS EN 60191-6-20. Mechanical standardization of semiconductor devices. Part 6-20. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
英国标准EN 60191-6-20 半导体器件的机械标准化 第6-20部分 表面安装半导体器件封装外形图绘制的一般规则 小外形J形引线封装（SOJ）的封装尺寸测量方法
2008-12-01
DIN IEC 60191-6-21-DRAFT
Draft Document - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
文件草案.半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 47D/733/CD:2008）
2009-02-01
DIN IEC 60191-6-20-DRAFT
Draft Document - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
文件草案.半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）的封装尺寸测量方法（IEC 47D/732/CD:2008）
2009-02-01
DIN EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法（IEC 60191-6-4-2003）；德文版EN 60191-6-4:2003
2004-01-01