MIL MIL-I-24768/11
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBG）
1992-02-25
MIL MIL-I-24768/12
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBM）
1992-02-25
MIL MIL-I-24768/12 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM)
酚醛树脂（PBM）纸基层压热固性塑料绝缘材料
2020-03-09
MIL MIL-I-24768/11 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG)
酚醛树脂（PBG）纸基层压热固性塑料绝缘材料
2020-03-09
MIL MIL-I-24768/10
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBE）
1992-02-25
MIL MIL-I-24768/22
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
纸基酚醛树脂（PBG-P）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/20
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PC)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBM-PC）
1992-02-25
MIL MIL-I-24768/21
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
纸基酚醛树脂（PBG-P）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/23
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PC)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBE-PC）
1992-02-25
MIL MIL-I-24768/24
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PF)
纸基酚醛树脂（PBM-PF）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/19
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-P)
纸基酚醛树脂（PBM-P）热固性层压塑料绝缘材料
1992-02-25
MIL MIL-I-24768/25
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PCF)
纸基酚醛树脂（PBE-PCF）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/24 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PF)
酚醛树脂（PBM-PF）纸基热固性层压塑料绝缘材料
2020-03-10
MIL MIL-I-24768/19 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-P)
酚醛树脂（PBM-P）纸基层压热固性塑料绝缘材料
2020-03-11
MIL MIL-I-24768/21 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
酚醛树脂（PBG-P）纸基热固性层压塑料绝缘材料
2020-03-10
MIL MIL-I-24768/25 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PCF)
酚醛树脂（PBE-PCF）纸基层压热固性塑料绝缘材料
2020-03-10
MIL MIL-I-24768/22 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
酚醛树脂（PBG-P）纸基热固性层压塑料绝缘材料
2020-03-10
UNE-EN 60249-2-1/A2-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICAION Nº1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:酚醛纤维素纸覆铜层压板 高电气质量
1996-10-14
UNE-EN 60249-2-2-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量
1996-10-14
UNE-EN 60249-2-2/A4-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量
1996-10-14