IPC 2222B
Sectional Design Standard for Rigid Organic Printed Boards
刚性有机印制板的截面设计标准
2020-10-01
NASA NHB 5300.4(3K)
DESIGN REQUIREMENTS FOR RIGID PRINTED WIRING BOARD
刚性印刷线路板的设计要求
1986-01-01
IPC M-105
Rigid Printed Board Manual
硬纸板手册
IPC 2223E
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
挠性/刚挠性印制板的分段设计标准
2020-01-24
GOST R 55693-2013
Платы печатные жесткие. Технические требования
刚性印刷板 技术要求
BS EN 62326-4-1997
Printed boards-Rigid multilayer printed boards with interlayer connections. Sectional specification
印制板 带有夹层连接的刚性多层印制板 分规范
1997-06-15
IPC D-422
Design Guide for Press Fit Rigid Printed Board Backplanes
压装刚性印制板背板设计指南
1982-09-01
BS 6221-11-1991
Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范
1991-08-30
MIL MIL-PRF-55110H Amendment 2
Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范
2017-05-19
MIL MIL-PRF-55110H Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范
2016-05-20
MIL MIL-PRF-55110G Notice 3-Revision
Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范
2008-02-29
MIL MIL-PRF-55110H Amendment 3
Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范
2018-03-26
MIL MIL-PRF-55110J
Printed Wiring Board, Rigid, General Specification for
刚性印制线路板通用规范
2020-05-16
IPC 6012E
Qualification and Performance Specification for Rigid Printed Boards
刚性印制板的鉴定和性能规范
2020-02-01
UNE-EN 62326-4-1999
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
印制板 第4部分:带夹层连接的刚性多层印制板 分规范
1999-04-19
KS C IEC 62326-4(2016 Confirm)
인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范
2011-07-28
BS 6221-10-1991
Printed wiring boards-Specification for flex-rigid double-sided printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性双面印制板规范
1991-09-30
KS C IEC 62326-4(2021 Confirm)
인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范
2011-07-28
GOST IEC 62326-4-2013
Платы печатные. Часть 4. Жесткие многослойные печатные платы с межслойными соединениями. Технические условия
印刷板具有层间连接的刚性多层印刷电路板 剖面规格
2013-11-14
IEC 62326-4-1996
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
印刷电路板 - 第4部分:具有层间连接的刚性多层印刷电路板 - 分段规格
1996-12-19