JIS C 60068-2-58-2002
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2部分:试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法
2002-01-01
UNE-EN 60068-2-58-2006
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属溶解性和耐焊接热的试验方法
2006-02-01
KS C IEC 60068-2-58(2017 Confirm)
기본 환경시험 절차－제2－58부：시험－시험 Td：표면실장부품 (SMD)의 납땜성, 금속 내침식성 및 납땜 내열성 시험방법
环境试验—第2－58部分:试验—试验Td:表面贴装器件（SMD）的可焊性、耐金属溶解性和耐焊接热的试验方法
2007-11-29
KS C IEC 60068-2-58(2022 Confirm)
기본 환경시험 절차－제2－58부：시험－시험 Td：표면실장부품 (SMD)의 납땜성, 금속 내침식성 및 납땜 내열성 시험방법
环境试验－第2－58部分:试验－试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法
2007-11-29
IEC 60068-2-58-2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境测试 - 第2-58部分:测试 - 测试Td:可焊性测试方法 金属化溶解性和表面贴装器件焊接热阻抗（smd）
2015-03-27
IEC 60068-2-58-2015+AMD1-2017 CSV
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验.第2-58部分:试验.试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法
2017-07-28
BS EN 60068-2-58-2015+A1-2018
Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境测试
2018-05-21
IEC 60068-2-58-2015/AMD1-2017
Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
修改件1——环境试验——第2-58部分:试验——试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法
2017-07-28
BS 11/30243259 DC
BS EN 60068-2-58. Environmental testing. Part 2-58. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
英国标准EN 60068-2-58 环境测试 第2-58部分 测验 测试Td 表面安装器件（SMD）的可焊性、耐金属化物溶解性和耐焊接热的试验方法
2011-02-16
JIS C 60068-2-20-2010
Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验第2-20部分:试验T:带引线器件的可焊性和耐焊接热的试验方法
2010-01-01
KS C IEC 60068-2-20
환경시험 — 제2-20부: 시험 — 시험 T: 리드가 있는 소자의 땜질성 및 땜질 내열성 시험방법
环境试验.第2-20部分:试验.试验T:带引线器件的可焊性和耐焊接热的试验方法
2021-06-16
GOST R IEC 60068-2-20-2015
Испытания на воздействие внешних факторов. Часть 2-20. Испытания. Испытание Т. Методы испытания на паяемость и стойкость к воздействию нагрева при пайке устройств с соединительными проводами
环境试验 第2-20部分 测试 测试T.具有引线的器件的焊接性和耐焊接性的测试方法
KS C IEC 60068-2-20
환경 시험 — 제2-20부: 시험 — 시험 Ta 및 Tb: 리드가 있는 부품의 땜질성 및 땜질 내열성 시험방법
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法
2022-12-08
IEC 60068-2-20-2021 RLV
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验第2-20部分:试验Ta和Tb试验:带引线器件的可焊性和耐焊接热的试验方法
2021-03-30
IEC 60068-2-20-2021
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法
2021-03-30
UNE-EN 60068-2-44-1996
ENVIRONMENTAL TESTING. PART 2: TESTS. GUIDANCE ON TEST T: SOLDERING.
环境测试 第2部分:测试 测试指南T:焊接
1996-07-10
UNE 20501-2-20-1994
BASIC ENVIRONMENTAL TESTING PROCEDURES. PART 2: TESTS. TEST T: SOLDERING.
基本环境测试程序 第2部分:测试 测试T:焊接
1994-01-20
GOST 28211-1989
Основные методы испытаний на воздействие внешних факторов. Часть 2. Испытания. Испытание Т: Пайка
基本环境检测程序 测试 测试T:焊接
GB/T 2424.17-2008
电工电子产品环境试验 第2部分：试验方法 试验T：锡焊试验导则
Environmental testing - Part 2: Tests methods guidance on - Test T: Soldering Test
2008-12-30
BS EN IEC 60068-2-20-2021
Environmental testing-Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境测试
2021-05-13