SJ 20642-1997
半导体光电模块总规范
Semiconductor opto-electronic module General specification for
1997-06-17
SJ 20642/5-1998
半导体光电模块 GH82型光耦合器模块详细规范
Semiconductor opto-electronic module Detail specification for type GH82 opto-couplers
1998-03-11
SJ 20642/6-1998
半导体光电模块GH83型光耦合器详细规范
Semiconductor opto-electronic module Detail specification for type GH83 opto-couplers
1998-03-11
SJ 20642/1-1998
半导体光电模块 GD81型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD81 PIN-FET opto-receiver module
1998-03-11
SJ 20642/2-1998
半导体光电模块GD82型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD82 PIN-FET opto-receiver module
1998-03-11
SJ 20642/3-1998
半导体光电模块GD83型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD83 PIN-FET opto-receiver module
1998-03-11
GB/T 35437-2017
星载光电跟踪成像系统通用规范
General specification for spaceborne opto-electronic tracking and imaging system
2017-12-29
SJ 20642/7-2000
半导体光电器件 GR1325J型长波长发光二极管组件详细规范
Semiconductor opto-electronic module Detail specification for type GR1325J light emitting diode module
2000-10-20
GB/T 12667-2012
同步电动机半导体励磁装置总技术条件
General specification for excitation assembly with semiconductors for synchronous motors
2012-06-29
GB/T 12669-2012
半导体变流串级调速装置总技术条件
General specification for cascade speed control assembly with semiconductor converter
2012-06-29
BS CECC 50000-1987
Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices
电子元件质量评定协调体系 总规范:分立半导体器件
1987-10-30
BS EN IEC 61191-1-2018
Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件
2018-11-13
BS EN 150001-1993
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: general purpose semiconductor diodes
电子元件质量评定协调体系规范 空白详细规范:通用半导体二极管
1981-03-15
BS EN 120000-1996
Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices
电子元件质量评定协调体系 总规范:半导体光电和液晶器件
1996-09-15
KS C IEC 61191-1(2016 Confirm)
인쇄기판 조립품－제1부：품목규격：표면실장 및 관련 조립기술을 이용하여 납땜된 전기전자 조립품에 대한 요구사항
印制板组件第1部分:总规范采用表面安装和相关组装技术的焊接电气和电子组件的要求
2006-12-18
KS C IEC 61191-1
인쇄회로기판 조립품 —제1부: 일반규격 — 표면실장 및 관련 실장기술을 이용하여 솔더링한 전기전자 조립품에 대한 요구사항
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2021-10-19
GB/T 19247.1-2003
印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2003-07-02
IEC 61191-1-2018 RLV
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2018-09-14
IEC 61191-1-2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2018-09-14
BS EN 153000-1998
Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)
电子元件质量评定协调体系 总规范:离散压力接触功率半导体器件（资格认证）
1998-07-15