SJ/T 11273-2016
免清洗液态助焊剂
No-clean liquid flux
2016-04-05
SME EE00-140
Parylene Conformal Coating Compatibility Evaluation With No-Clean Solder Pastes, Wave Solder Fluxes And Flux Cored Wire Solders
Parylene保形涂层与无清洁锡膏、波形焊剂和药芯焊丝焊料的相容性评估
2000-11-01
CID A-A-51145D
FLUX, SOLDERING, NON-ELECTRONIC, PASTE AND LIQUID (SUPERSEDING A-A-51145C)
非电子焊剂、锡膏和液体（替代A-A-51145C）
2001-07-27
ISO 9455-18-2024
Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
软钎焊剂试验方法第18部分:清洁前后焊接印刷电路组件的清洁度
2024-08-16
ASTM B813-24
Standard Specification for Water Flushable Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
铜和铜合金管焊接用水冲洗液体和糊状焊剂的标准规范
2024-07-01
BS EN 60512-12-6-1997
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests-Test 12f. Sealing against flux and cleaning solvents in machine soldering
电子设备用机电元件 基本测试程序和测量方法 焊接试验
1997-04-15
MIL MIL-F-14256E Amendment 1
FLUX, SOLDERING, LIQUID (ROSIN BASE) (S/S BY MIL-F-14256F) (SUPERSEDING MIL-F-14256D)
液体助焊剂（松香基）（由MIL-F-14256F提供）（取代MIL-F-14256D）
1990-07-21
MIL MIL-F-14256F
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
助焊剂 焊接 液体 焊膏助焊剂 焊膏和焊膏助焊剂（电子/电气用） 通用规范（由ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995代替MIL-F-14256E）
1993-04-26
QPL QPL-14256-88
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING QPL-14256-87)
助焊剂 焊接 液体 焊膏助焊剂 焊膏和焊膏助焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995 取代QPL-14256-87）
1995-03-31
MIL MIL-F-14256F Amendment 1
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
焊剂 液体 膏状焊剂 焊膏和焊料膏状焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995和ANSI/J-STD--006-1995-1995）（代替MIL-F-14256E）
1994-05-18
MIL MIL-F-14256F Notice 1-Cancellation
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
焊剂 液体 膏状焊剂 焊膏和焊料膏状焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995和ANSI/J-STD--006-1995-1995）（代替MIL-F-14256E）
1995-06-15
GB/T 5095.12-1997
电子设备用机电元件 基本试验规程及测量方法 第12部分:锡焊试验 第六篇:试验12f在机器焊接中封焊处耐焊剂和清洁剂
Electromechanical components for electronic equipment--Basic testing procedures and measuring methods--Part 12:Soldering tests--Section 6:Test 12f--Sealing against flux and cleaning solvents inmachine soldering
1997-12-26
IEC 60512-12-6-1996
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering
电子设备机电组件 - 基本测试程序和测量方法 - 第12部分:焊接测试 - 第6节:测试12f:机器焊接中的通量和清洁溶剂密封
1996-01-30
DIN EN 60512-12-6
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996); German version EN 60512-12-6:1996
电子设备用机电元件.基本试验程序和测量方法.第12部分:焊接试验.第6节:试验12f:机器焊接中抗助焊剂和清洁溶剂的密封（IEC 60512-12-6-1996）；德文版EN 60512-12-6:1996
1996-09-01