SJ 50192/1-2002
CCK4101型有可靠性指标的无包封多层片式瓷介电容器详细规范
Capacitors, chip, multilayer, ceramic dielectric, unencapsulated, estabilished reliability, detail specification for CCK4101 type
2002-01-31
DOD DOD-C-55681/11
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR35 METRIC
已确立可靠性的陶瓷介质多层固定无封装片式电容器CDR35公制
1983-08-25
MIL MIL-PRF-49464/1C Notice 1-Validation 1
Capacitors, Chip, Single Layer, Fixed Unencapsulated, Ceramic Dielectric, Established Reliability, Style CPCR01 (High Frequency)
CPCR01型（高频）陶瓷电介质固定式单层芯片电容器
2016-03-22
SJ 20203-1992
CTK4101型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability, type CTK4101
1992-11-19
SJ 20312-1993
CTK4102型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4102
1993-05-11
SJ 20313-1993
CTK4103型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4103
1993-05-11
SJ 20314-1993
CTK4104型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4104
1993-05-11
SJ 20318-1993
CCK4103型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4103
1993-05-11
DOD DOD-C-55681/10
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR34 METRIC(NO S/S DOCUMENT)
固定式、非封装陶瓷介质多层片式电容器 已确立的可靠性类型CDR34公制（无S/S文件）
1983-08-25
DOD DOD-C-55681/9
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR33 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR33公制（无S/S文件）
1983-08-25
DOD DOD-C-55681/8
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR32 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR32公制（无S/S文件）
1983-08-25
MIL MIL-C-55681D
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确立可靠性的多层固定无封装陶瓷介质片式电容器（取代MIL-C-55681C）（由MIL-PRF-55681E提供）
1994-07-13
MIL MIL-C-55681D Supplement 1
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确定可靠性的多层固定、未封装陶瓷电介质芯片电容器（取代MIL-C-55681C）的通用规范
1994-07-13
MIL MIL-C-55681/6 Notice 1-Validation
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 芯片 多层 固定 未封装 陶瓷电介质 建立可靠性 样式CDR26 CDR27 CDR28 CDR29和CDR30（S/S BY MIL-PRF-55681/6A）
1989-06-05
MIL MIL-C-55681/6
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 片式 多层 固定 未封装 陶瓷介质 可靠 型号CDR26 CDR27 CDR28 CDR29和CDR30（S/S由MIL-PRF-55681/6A提供）
1981-07-30
MIL MIL-C-55681/6 Amendment 1
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 芯片 多层 固定的 未封装的 陶瓷电介质 已建立的可靠性 型号CDR26 CDR27 CDR28 CDR29和CDR30（由MIL-PRF-55681/6A制成）
1991-04-01
MIL MIL-C-49464/1 Amendment 1
CAPACITORS, CHIP, SINGLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CPCR01 (HIGH FREQUENCY) (NO S/S DOCUMENT) (S/S BY MIL-C-49464/1A)
电容器 芯片 单层 固定不动 陶瓷电介质 建立可靠性 样式CPCR01（高频）（无S/S文件）（MIL-C-49464/1A的S/S）
1989-03-22
MIL MIL-C-55681/4B Amendment 7
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY) (S/S BY MIL-C-55681/4C)
多层固定无封装陶瓷介质芯片电容器 可靠性高 CDR11、CDR12、CDR13和CDR14（高频）（MIL-C-55681/4C标准S/S）
1985-10-07
MIL MIL-C-49464/1
CAPACITORS, CHIP, SINGLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CPCR01 (HIGH FREQUENCY) (NO S/S DOCUMENT) (S/S BY MIL-C-49464/1A)
CPCR01（高频）型单层固定无封装陶瓷介质片式电容器（无S/S文件）（MIL-C-49464/1A提供的S/S）
1988-05-12
MIL MIL-C-55681/7A Notice 1-Validation
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CDR31, METRIC (SUPERSEDING MIL-C-55681/7) (S/S BY MIL-PRF-55681/7B)
芯片电容器 多层 固定的 未封装的 陶瓷电介质 已建立的可靠性 CDR31型 公制（取代MIL-C-55681/7）（S/S BY MIL-PRF-55681/7B）
1994-11-15