Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
Buld Up/High Density Interconnect（HDI）印制电路板的术语和定义、试验方法和设计示例
2000-01-01
IEC TR 61189-3-914-2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
电气材料、印制板和其他互连结构和组件的试验方法.第3-914部分:高亮度LED用印制电路板导热性的试验方法.指南