SJ 21269-2018
微波组件印制板焊膏印刷工艺技术要求
Technical requirements for pasting solder on PCB of microwave assembly
2018-01-18
BS EN 61192-5-2007
Workmanship requirements for soldered electric assemblies-Rework, modification and repair of soldered electronic assemblies
焊接电气组件的工艺要求
2007-07-31
BS EN 61192-4-2003
Workmanship requirements for soldered electronic assemblies-Terminal assemblies
焊接电子组件的工艺要求
2003-06-30
IPC J-STD-001H
Requirements for Soldered Electrical and Electronic Assemblies
焊接电气和电子组件的要求
2020-09-01
BS EN 61192-2-2003
Workmanship requirements for soldered electronic assemblies-Surface-mount assemblies
焊接电子组件的工艺要求
2003-06-25
BS EN IEC 61191-1-2018
Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件
2018-11-13
BS EN 61192-1-2003
Workmanship requirements for soldered electronic assemblies-General
焊接电子组件的工艺要求
2003-06-26
KS C IEC 61192-5(2017 Confirm)
납땜된 전자조립품에 대한 작업 요구사항－제5부：납땜된 전자조립품의 재작업,보정 및 수리
焊接电子组件工艺要求第5部分:焊接电子组件的返工、修改和修理
2012-11-19
KS C IEC 61192-5(2022 Confirm)
납땜된 전자조립품에 대한 작업 요구사항－제5부：납땜된 전자조립품의 재작업,보정 및 수리
焊接电子组件的工艺要求第5部分:焊接电子组件返工、修改和修理
2012-11-19
KS C IEC 61192-4(2017 Confirm)
납땜된 전자조립품에 대한 기량 요구사항－제4부：단자 조립품
焊接电子组件工艺要求第4部分:端子组件
2007-11-29
BS EN 61192-3-2003
Workmanship requirements for soldered electronic assemblies-Through-hole mount assemblies
焊接电子组件的工艺要求
2003-04-07
BS EN 61191-4-2017
Printed board assemblies-Sectional specification. Requirements for terminal soldered assemblies
印制板组件
2017-11-20
KS C IEC 61192-4(2022 Confirm)
납땜된 전자조립품에 대한 기량 요구사항－제4부：단자 조립품
焊接电子组件的工艺要求第4部分:端子组件
2007-11-29
GOST R IEC 61192-4-2010
Печатные узлы. Требования к качеству. Часть 4. Монтаж контактов
焊接电子组件 做工要求端子组件
KS C IEC 61191-1(2016 Confirm)
인쇄기판 조립품－제1부：품목규격：표면실장 및 관련 조립기술을 이용하여 납땜된 전기전자 조립품에 대한 요구사항
印制板组件第1部分:总规范采用表面安装和相关组装技术的焊接电气和电子组件的要求
2006-12-18
KS C IEC 61191-1
인쇄회로기판 조립품 —제1부: 일반규격 — 표면실장 및 관련 실장기술을 이용하여 솔더링한 전기전자 조립품에 대한 요구사항
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2021-10-19
GB/T 19247.1-2003
印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2003-07-02
IEC 61191-1-2018 RLV
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2018-09-14
IEC 61191-1-2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2018-09-14
GB/T 31476-2015
电子装联高质量内部互连用焊料
Requirements for solders for high-quality interconnections in electronics assembly
2015-05-15