부품내장 조립기술 — 제2-602부: 적층 전자 모듈의 지침 — 내부 모듈 간 전기 접속 평가 방법
器件嵌入组装技术.第2-602部分:堆叠电子模块指南.模块间电气连接的评估方法
2024-11-26
IEC 62878-2-603-2025
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
器件嵌入装配技术 第2-603部分:堆叠式电子模块导则 模块内电连接性的试验方法
2025-02-25
IEC 62878-2-602-2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
器件嵌入组装技术.第2-602部分:堆叠电子模块指南.模块间电气连接的评估方法
2021-06-22
DIN EN IEC 62878-2-602-DRAFT
Draft Document - Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English
文件草案-设备嵌入组装技术-第2-602部分:堆叠电子模块指南-模块间电气连接的评估方法（IEC 91/1629/CD:2019）；德语和英语文本