HB/Z 5089.1-2004
电镀黑镍溶液分析方法 第1部分:离子选择电极法测定硫酸镍铵的含量
Methods for analysis of plating black nickel solutions
2004-02-16
HB/Z 5089.5-2004
电镀黑镍溶液分析方法 第5部分:电位滴定法测定硫氰酸铵的含量
Methods for analysis of plating black nickel solutions-Part 5:Determination of ammonium thiocyanate content by potentiometric titrimetric method
2004-02-16
HB/Z 5089.4-2004
电镀黑镍溶液分析方法 第4部分:沉淀滴定法测定硫酸钠的含量
Methods for analysis of plating black nickel solutions-Part 4:Determination of sodium sulfate content by precipitation titrimetric method
2004-02-16
HB/Z 5089.3-2004
电镀黑镍溶液分析方法 第3部分:EDTA络合滴定法连续测定硫酸镍和硫酸锌的含量
Methods for analysis of plating black nickel solutions-Part 3:Continual determination of nickel sulfate and zinc sulfate content by EDTA compleximetric method
2004-02-16
HB/Z 5089.2-2004
电镀黑镍溶液分析方法 第2部分:镁盐返滴定EDTA容量法连续测定硫酸镍和硫酸锌的含量
Methods for analysis of plating black nickel solutions-Part 2:Continual determination of nickel sulfate and zinc sulfate content by magnesium sulfate back titrimetric EDTA volumetric method
2004-02-16
HB/Z 5087.6-2004
酸性电镀铜溶液分析方法 第6部分:分光光度法测定砷的含量
Methods for analysis of acid plating copper solutions part 6:Determination of arsenic content by spectrophotometric method
2004-02-16
HB/Z 5087.5-2004
酸性电镀铜溶液分析方法 第5部分:原子吸收光谱法测定硫酸镍的含量
Methods for analysis of acid plating copper solutions part 5:Determination of nickel sulfate content by atomic absorption spectrometric method
2004-02-16
HB 20056.6-2011
锡-铋合金镀层及电镀锡-铋合金溶液分析方法 第6部分:酸碱滴定法测定硫酸含量
Methods for analysis of Sn-Bi alloy plating and plating Sn-Bi alloy solutions-Part 6:Determination of sulphuric acid content by acid-base titrimetric method
2011-07-19
HB/Z 5096.1-2004
电镀铅溶液分析方法 第1部分:EDTA容量法测定氧化铅的含量
Methods for analysis of plating lead solutions -- Part 1: Determination of lead oxide content by EDTA volumetric method
2004-02-16
HB 20056.1-2011
锡-铋合金镀层及电镀锡-铋合金溶液分析方法 第1部分:分光光度法测定铋含量
Methods for analysis of Sn-Bi alloy plating and plating Sn-Bi alloy solutions-Part 1:Determination of bismuth content by spectrophotometric method
2011-07-19
JB/T 7520.6-2017
铜基钎料化学分析方法 第6部分：镍量测定
Methods for chemical analysis of copper base brazing fùler metals-Part 6:Determination of nickel content
2017-11-07
HB/Z 5087.7-2004
酸性电镀铜溶液分析方法 第7部分:原子吸收光谱法测定锑的含量
Methods for analysis of acid plating copper solutions part 7:Determination of antimony content by atomic absorption spectrometric method
2004-02-16
HB/Z 5094.3-2004
酸性电镀锡溶液分析方法 第3部分:原子吸收光谱法测定铅的含量
Methods for analysis of acid plating tin solutions -- Part 3: Determination of lead content by atomic absorption spectrometric method
2004-02-16
HB/Z 5095.3-2004
氰化电镀黄铜溶液分析方法 第3部分:电位滴定法测定碳酸钠的含量
Methods for analysis of cyaniding plating brass solutions -- Part 3: Determination of sodium carbonate content by potentiometric titrimetric method
2004-02-16
HB/Z 5094.4-2004
酸性电镀锡溶液分析方法 第4部分:原子吸收光谱法测定铜的含量
Methods for analysis of acid plating tin solutions -- Part 4: Determination of copper content by atomic absorption spectrometric method
2004-02-16
HB/Z 5087.4-2004
酸性电镀铜溶液分析方法 第4部分:原子吸收光谱法测定铁的含量
Methods for analysis of acid plating copper solutions part 4:Determination of iron content by atomic absorption spectrometric method
2004-02-16
HB/Z 5087.3-2004
酸性电镀铜溶液分析方法 第3部分:电位滴定法测定硫酸的含量
Methods for analysis of acid plating copper solutions part 3:Determination of sulphuric acid content by potentiometric titrimetric method
2004-02-16
HB/Z 5087.2-2004
酸性电镀铜溶液分析方法 第2部分:电位滴定法测定硫酸铜的含量
Methods for analysis of acid plating copper solutions part 2:Determination of copper sulfate content by potentiometric titrimetric method
2004-02-16
HB/Z 5096.2-2004
电镀铅溶液分析方法 第2部分:电位滴定法测定氟硼酸(游离)的含量
Methods for analysis of plating lead solutions -- Part 2: Determination of free fluorboric acid content by potentiometric titrimetric method
2004-02-16
HB 20056.2-2011
锡-铋合金镀层及电镀锡-铋合金溶液分析方法 第2部分:分光光度法测定硝酸铋含量
Methods for analysis of Sn-Bi alloy plating and plating Sn-Bi alloy solutions-Part 2:Determination of bismuth nitrate content by spectrophotometric method
2011-07-19