电镀铅溶液分析方法 第2部分:电位滴定法测定氟硼酸(游离)的含量电镀铅溶液分析方法 第2部分:电位滴定法测定氟硼酸(游离)的含量Methods for analysis of plating lead solutions -- Part 2: Determination of free fluorboric acid content by potentiometric titrimetric method
电镀铅溶液分析方法 第1部分:EDTA容量法测定氧化铅的含量
Methods for analysis of plating lead solutions -- Part 1: Determination of lead oxide content by EDTA volumetric method
2004-02-16
HB/Z 5094.3-2004
酸性电镀锡溶液分析方法 第3部分:原子吸收光谱法测定铅的含量
Methods for analysis of acid plating tin solutions -- Part 3: Determination of lead content by atomic absorption spectrometric method
2004-02-16
HB/Z 5087.2-2004
酸性电镀铜溶液分析方法 第2部分:电位滴定法测定硫酸铜的含量
Methods for analysis of acid plating copper solutions part 2:Determination of copper sulfate content by potentiometric titrimetric method
2004-02-16
HB 20056.2-2011
锡-铋合金镀层及电镀锡-铋合金溶液分析方法 第2部分:分光光度法测定硝酸铋含量
Methods for analysis of Sn-Bi alloy plating and plating Sn-Bi alloy solutions-Part 2:Determination of bismuth nitrate content by spectrophotometric method
2011-07-19
HB/Z 5095.2-2004
氰化电镀黄铜溶液分析方法 第2部分:电位滴定法测定氰化钠(游离)的含量
Methods for analysis of cyaniding plating brass solutions -- Part 2: Determination of free sodium cyanate content by potentiometric titrimetric method
2004-02-16
HB/Z 5094.2-2004
酸性电镀锡溶液分析方法 第2部分:电位滴定法测定硫酸(游离)的含量
Methods for analysis of acid plating tin solutions -- Part 2: Determination of free sulphuric acid content by potentiometric titrimetric method
2004-02-16
HB/Z 5089.2-2004
电镀黑镍溶液分析方法 第2部分:镁盐返滴定EDTA容量法连续测定硫酸镍和硫酸锌的含量
Methods for analysis of plating black nickel solutions-Part 2:Continual determination of nickel sulfate and zinc sulfate content by magnesium sulfate back titrimetric EDTA volumetric method