Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化
2011-08-31
IEC 60191-6-12-2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化 - 第6-12部分:表面贴装半导体器件封装外形图准备的一般规则 - 精细间距栅格阵列(FLGA)设计指南