JB/T 10097-2000
电力半导体器件用管壳
Case for power semiconductor device
2000-04-24
DIN 41881-2
Semiconductor devices; metal cases with ceramic insulation, requirements and tests
半导体器件；陶瓷绝缘金属外壳.要求和试验
1978-06-01
JB/T 10096-2000
电力半导体器件用管壳选用导则
Selection guidance of case for power semiconductor device
2000-04-24
IEC 60747-15-2024
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件
2024-10-22
IEC 60747-15-2024 RLV
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件
2024-10-22
BS 07/30162213 DC
BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
英国标准EN 60747-15 半导体器件 分立器件第15部分 隔离功率半导体器件
2007-02-07
IEC 63244-1-2021
Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
半导体器件.无线功率传输和充电用半导体器件.第1部分:一般要求和规范
2021-09-14
GB/T 8446.1-2022
电力半导体器件用散热器 第1部分：散热体
Heat sinks for power semiconductor devices—Part 1: Radiators
2022-03-09
IEC 62435-9-2021
Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
电子元件.电子半导体器件的长期贮存.第9部分:特殊情况
2021-08-25
DIN IEC 60747-15-DRAFT
Draft Document - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
文件草案.半导体器件.分立器件.第15部分:隔离功率半导体器件（IEC 47E/322/CD:2007）
2007-06-01
IEC 62830-2-2017
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
半导体器件 - 用于能量收集和生成的半导体器件 - 第2部分:基于热能的热电收获
2017-01-20
IEC 60749-34-1-2025
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
半导体器件 机械和气候试验方法 第34-1部分:功率半导体模块的功率循环试验
2025-06-20
IEC 62830-5-2021
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
半导体器件.能量收集和产生用半导体器件.第5部分:测量柔性热电器件产生功率的试验方法
2021-01-21
GB/T 8446.3-2022
电力半导体器件用散热器 第3部分：绝缘件和紧固件
Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
2022-03-09
UNE-EN 60749-34-2005
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
半导体器件机械和气候试验方法第34部分:功率循环
2005-03-16
KS C IEC 60749-34
반도체 소자－기계 및 기후적 환경 시험 방법－제34부：전력 사이클링
半导体器件机械和气候试验方法第34部分:功率循环
2017-05-30
KS C IEC 60749-34(2022 Confirm)
반도체 소자－기계 및 기후적 환경 시험 방법－제34부：전력 사이클링
半导体器件机械和气候试验方法第34部分:功率循环
2017-05-30
GB/T 4937.34-2024
半导体器件 机械和气候试验方法 第34部分：功率循环
Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling
2024-03-15
IEC 60749-34-2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
半导体器件 - 机械和气候测试方法 - 第34部分:电力循环
2010-10-28
GB/T 7576-1998
半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范
Semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification
1998-11-17