Standard Specification for Gold Wire for Semiconductor Lead Bonding
半导体引线键合用金线的标准规范
2024-04-01
YS/T 543-2015
半导体键合用铝-1%硅细丝
Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding
2015-04-30
SJ/T 10626-1995
键合金丝中微量杂质的ICP发射光谱分析方法
Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES
1995-04-22
GB/T 34507-2017
封装键合用镀钯铜丝
Palladium coated copper bonding wire for semiconductor package
2017-10-14
GB/T 8750-2022
半导体封装用金基键合丝、带
Gold-based bonding wire and bandlet for semiconductor package
2022-12-30
GB/T 34502-2017
封装键合用镀金银及银合金丝
Gold-coated silver and silver alloy bonding wires for semiconductor package
2017-09-29
DIN 45910-127
Harmonized system of quality assessment for electronic components; detail specification: Polar aluminium electrolytic capacitors with non solid electrolyte, DC 40 to 100 V (suitable to V a.c. load without using a polarizing potential), general-purpose grade, cylindrical metal case with insulation sleeve, axial wire leads, climatic category 40/085/56 (CECC 30301-045)
电子元件质量评定协调体系；详细规范:DC 40至100 V（适用于交流电压负载 无需使用极化电位）的非固体电解质极性铝电解电容器 通用级 带绝缘层的圆柱形金属外壳