BS IEC 62899-201-2016+A1-2018
Printed electronics-Materials. Substrates
印刷电子产品
2019-01-03
UNE 54021-1999
PRINTS AND PRINTING INKS. DETERMINATION OF RESISTANCE TO STERILISATION OF PRINTS ON METALLIC SUBSTRATES.
印刷品和印刷油墨 金属基材上印刷品耐灭菌性的测定
1999-04-06
KS C IEC 62899-201
인쇄전자 — 제201부: 재료 — 기판
印刷电子 - 第201部分:材料 - 基板
2020-12-16
IPC 4921A
Requirements for Printed Electronics Base Materials (Substrates)
印刷电子基础材料（基板）的要求
2017-05-01
KS C IEC 62899-201
인쇄전자 — 제201부: 재료 — 기판
印刷电子产品第201部分:材料基板
2021-12-29
IEC 62899-201-2016+AMD1-2018 CSV
Printed electronics - Part 201: Materials - Substrates
印刷电子产品第201部分:材料基板
2018-11-15
IEC 62899-201-2016
Printed electronics - Part 201: Materials - Substrates
印刷电子 - 第201部分:材料 - 基板
2016-02-25
GB/T 39975-2021
氮化铝陶瓷散热基片
Aluminum nitride ceramic dissipate heat substrates
2021-05-21
IPC 6902
Qualification and Performance Specification for Printed Electronics on Flexible Substrates
柔性基板上印刷电子产品的鉴定和性能规范
2021-03-08
IEC 62899-201-2-2021
Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
印刷电子.第201-2部分:材料.基板.可拉伸基板性能的测量方法
2021-10-14
BS IEC 62899-202-7-2021
Printed electronics-Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
印刷电子产品
2021-03-11
IEC 62899-201-2016/AMD1-2018
Amendment 1 - Printed electronics - Part 201: Materials - Substrates
修改件1.印刷电子产品.第201部分:材料.基板
2018-11-15
HG/T 5527-2019
铝基脱硫剂化学成分分析方法
Analytical method of chemical composition for aluminum substrate desulfurization agent
2019-08-02
BS 6221-22-1990
Printed wiring boards-Guide to the use of printed wiring board substrate materials: surface mount technology
印刷线路板 印刷线路板基板材料使用指南:表面安装技术
1990-12-31
BS DD IEC/PAS 62326-14-2010
Printed boards-Device embedded substrate. Terminology / reliability / design guide
印制板 设备嵌入基板 术语/可靠性/设计指南
2010-11-30
JB/T 8736-1998
电力半导体模块用氮化铝陶瓷基片
Aluminum nitride ceramics substrate intended to be used in power semiconductor modules
1998-05-28
IEC 62899-202-7-2021
Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
印刷电子.第202-7部分:材料.印刷薄膜.用90°剥离法测量柔性衬底上印刷层的剥离强度
2021-03-03
CY/T 201-2019
纸质凹版印刷产品质量要求及检验方法
Quality requirements and inspection methods for products printed on paper substrates using rotogravure
2019-11-28
KS C IEC 62899-202-5
인쇄전자 — 제202-5부: 재료 — 전도성 잉크 — 절연 기판에 인쇄된 전도층의 기계적 굽힘 시험방법
印刷电子产品第202-5部分:材料导电油墨绝缘基底上印刷导电层的机械弯曲试验
2023-11-17
IEC 62899-202-5-2018
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
印刷电子.第202-5部分:材料.导电油墨.绝缘衬底上印刷导电层的机械弯曲试验
2018-09-28