不透性石墨粘接剂粘接抗拉强度试验方法
Test method of the adhesion tensile strength of graphite impemeable adhesion agent
2009-04-29
GB/T 13465.8-2009
不透性石墨粘接剂粘接剪切强度试验方法
Test method of the adhesion shear strength of impermeable graphite adhesion agent
2009-04-29
YY/T 0729.1-2009
组织粘合剂粘接性能试验方法 第1部分：搭接-剪切拉伸承载强度
Test methods for boning properties of tissue adhesives—Part 1:Strength in lap-shear by tension loading
2009-06-16
DIN 13990-1
Dentistry - Test methods for shear bond strength of adhesives for orthodontic attachments - Part 1: Bonding of the interfacial surfaces adhesive-attachment and adhesive-enamel
牙科学.正畸附着体用胶粘剂剪切粘结强度的试验方法.第1部分:粘接附着体和粘接珐琅质界面的粘结
2009-05-01
BS 10/30211454 DC
BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures
英国标准EN 62047-13 半导体器件 微型机电设备 第13部分 测量MEMS结构粘接强度的弯曲和剪切试验方法
2010-02-22
DIN IEC 62047-13-DRAFT
Draft Document - Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
文件草稿——半导体器件——微电子机械器件——第13部分:弯曲和剪切——测量MEMS结构粘接强度的试验方法（IEC 47F/44/CD:2010）
2010-05-01
DIN EN 62047-13
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
半导体器件.微机电器件.第13部分:测量MEMS结构粘接强度的弯曲和剪切型试验方法（IEC 62047-13-2012）；德文版EN 62047-13:2012