作废 YS/T 678-2008
半导体器件键合用铜丝 半导体器件键合用铜丝 Copper wire for semiconductor lead bonding
发布日期:2008-03-12
实施日期:2008-09-01
分类信息
研制信息

归口单位: 全国有色金属标准化技术委员会

起草单位: 贺利氏招远贵金属材料有限公司、 贺利氏招远(常熟)电子材料有限公司

起草人: 刘光瑞、 王卫东、 毛松林、 杨茵年、 丁颖

标准简介

本标准规定了半导体器件键合用铜丝的要求、试验方法、检验规范和标志、包装、运输、贮存及订货单(或合同)内容。本标准适用于半导体器件键合用铜丝(以下简称铜丝)

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铜丝合用半导体器件

最后更新时间 2025-08-31