GB/T 31556.1-2015
包装袋 尺寸描述和测量方法 第1部分：纸袋
Packaging sacks—Description and method of measurement for dimension—Part 1: Paper sacks
2015-05-15
BS EN 26591-1-1993
Packaging. Sacks. Description and method of measurement-Empty paper sacks
包装材料麻袋 描述和测量方法 空纸袋
1993-03-15
ISO 6591-1-1984
Packaging — Sacks — Description and method of measurement — Part 1: Empty paper sacks
包装与包装；麻袋和麻袋；说明和测量方法第1部分:空纸袋
1984-08-01
BS EN 26591-2-1993
Packaging. Sacks. Description and method of measurement-Empty sacks made from thermoplastic flexible film
包装材料麻袋 描述和测量方法 由热塑性柔性薄膜制成的空袋
1993-03-15
UNE-EN 26591-1-1993
PACKAGING. SACKS. DESCRIPTION AND METHOD OF MEASUREMENT. PART 1: EMPTY PAPER SACKS. (ISO 6591-1:1984).
包装材料麻袋 描述和测量方法 第一部分:空纸袋 （ISO 6591-1-1984）
1993-11-23
KS T ISO 6591-2
포장 — 포대 — 표기 및 측정방법 —제2부: 플라스틱필름 포대
包装 - 袋 - 测量说明和方法 - 第2部分:由热塑性柔性薄膜制成的空袋
2020-08-07
ISO 6591-2-1985
Packaging — Sacks — Description and method of measurement — Part 2: Empty sacks made from thermoplastic flexible film
包装与包装；麻袋和麻袋；说明和测量方法第2部分:热塑性柔性薄膜制成的空袋
1985-11-14
JIS Z 1531-1-2004
Kraft paper sacks -- Description and method of measurement
牛皮纸袋描述和测量方法
2004-01-01
KS T ISO 6591-1
공지대의 치수 표기 및 측정 방법
描述和测量的方法 用于空纸袋
2020-12-31
UNE-EN 26591-2-1995
PACKAGING. SACKS. DESCRIPTION AND METHOD OF MEASUREMENT. PART 2: EMPTY SACKS MADE FROM THERMOPLASTIC FLEXIBLE FILM. (ISO 6591-2:1985).
包装材料麻袋 描述和测量方法 第2部分:由热塑性柔性薄膜制成的空袋 （ISO 6591-2:1985）
1995-01-20
DIN EN 26591-1
Packaging; sacks; description and method of measurement; part 1: empty paper sacks (ISO 6591-1:1984); german version EN 26591-1:1992
包装材料麻袋；描述和测量方法；第1部分:空纸袋（ISO 6591-1-1984）；德文版EN 26591-1:1992
1993-02-01
DIN EN 26591-2
Packaging; sacks; description and method of measurement; part 2: empty sacks made from thermoplastic flexible film (ISO 6591-2:1985); german version EN 26591-2:1992
包装材料麻袋；描述和测量方法；第2部分:热塑性柔性薄膜制空袋（ISO 6591-2-1985）；德文版EN 26591-2:1992
1993-02-01
BS EN 60191-6-21-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化
2010-12-31
BS EN 60191-6-20-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化
2010-12-31
IEC 60191-6-21-2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法
2010-08-30
BS EN 60191-6-4-2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2003-08-04
IEC 60191-6-20-2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法
2010-08-30
BS 08/30190030 DC
BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
英国标准EN 60191-6-21 半导体器件的机械标准化 第6-21部分 表面安装半导体器件封装外形图绘制的一般规则 小外形包装的包装尺寸测量方法（SOP）
2008-12-01
GB/T 15879.604-2023
半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
2023-05-23
IEC 60191-6-4-2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法
2003-06-11