UNE 20620-4-1980
METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. COPPER FOIL
印制电路用金属包覆基材 铜箔
1980-12-15
SJ 21287-2018
高密度互连印制电路用涂树脂铜箔规范
Specification for resin coated copper foil of HDI printed circuit board
2018-01-18
GB/T 36476-2018
印制电路用金属基覆铜箔层压板通用规范
General specification for metal base copper-clad laminates for printed circuits
2018-06-07
MIL MIL-PRF-31032B Amendment 1(amendment incorporated)
Printed Circuit Board/Printed Wiring Board, General Specification for
印刷电路板/印刷线路板通用规范
2012-05-16
MIL MIL-PRF-31032B Supplement 1
Printed Circuit Board/Printed Wiring Board, General Specification for
印刷电路板/印刷线路板通用规范
2010-01-31
SJ 21079-2016
金属基印制板性能规范
Performace specification for metal base printed circuit boards
2016-01-19
BS 4584-103.2-1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范
1990-02-28
GOST 26246.12-1989
Пленка полиимидная фольгированная общего назначения для гибких печатных плат. Технические условия
用于柔性印刷板的通用聚酰亚胺箔包覆膜 规格
GB/T 39342-2020
宇航电子产品 印制电路板总规范
Aerospace electronic products—General specification for printed circuit board
2020-11-19
GOST R 54849-2011
Маска паяльная защитная для печатных плат. Общие технические условия
印刷电路板用保护性阻焊剂 一般规格
MIL MIL-DTL-19834C Notice 1-Validation
Plates, Identification or Instruction, Metal Foil, Adhesive Backed General Specification for
胶粘背衬金属箔标识或说明板通用规范
2016-01-06
MIL MIL-DTL-19834C Amendment 1(amendment incorporated)
Plates, Identification or Instruction, Metal Foil, Adhesive Backed General Specification for
胶粘背衬金属箔标识或说明板通用规范
2011-02-09
QPL QML-31032-18
PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR(SUPERSEDING QML-31032-17)
印刷电路板/印刷线路板通用规范（代替QML-31032-17）
2006-11-21
MIL MIL-PRF-31032B Notice 1-Supplement 1
PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-PRF-31032A)
印刷电路板/印刷线路板通用规范（代替MIL-PRF-31032A）
2010-01-31
MIL MIL-PRF-31032A Notice 2-Supplement 1
PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-PRF-31032)
印刷电路板/印刷线路板通用规范（代替MIL-PRF-31032）
2008-03-17
MIL MIL-PRF-31032A Notice 1-Amendment 1
PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-PRF-31032)
印刷电路板/印刷线路板通用规范（代替MIL-PRF-31032）
2006-02-24
MIL MIL-PRF-31032B Notice 2-Amendment 1
PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-PRF-31032A)
印刷电路板/印刷线路板通用规范（代替MIL-PRF-31032A）
2012-05-16
MIL MIL-PRF-31032C
PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-PRF-31032B)
印刷电路板/印刷线路板通用规范（代替MIL-PRF-31032B）
2016-11-16
UNE 20620-3-1-1981
METAL-CLAS BASE MATERIALS FOR PRINTED CIRCUITS. SPECIAL MATERIALS. SPECIFICATION NO.1: PRE-PREG FOR MULTILAYER PRINTED BOARDS
印刷电路板用金属覆层基材 特殊材料 规范1:多层印制板的预浸
1981-12-15
GOST 26246.4-1989
Материал электроизоляционный фольгированный общего назначения для печатных плат на основе стеклоткани, пропитанной эпоксидным связующим. Технические условия
环氧浸渍玻璃织物箔包覆电绝缘材料 一般用于印刷板 规格