GB/T 31475-2015
电子装联高质量内部互连用焊锡膏
Requirements for solder paste for high-quality interconnections in electronics assembly
2015-05-15
GB/T 31474-2015
电子装联高质量内部互连用助焊剂
Soldering fluxes for high-quality interconnections in electronics assembly
2015-05-15
BS EN 61190-1-2-2014
Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly
电子组装用附件材料
2014-06-30
BS EN 61190-1-1-2002
Attachment materials for electronic assembly-Requirements for soldering fluxes for high-quality interconnections in electronics assembly
电子组装用附件材料
2002-08-16
GOST R IEC 61190-1-1-2020
Материалы для электронных модулей. Часть 1-1. Требования к паяльным флюсам для высококачественных межсоединений в электронных сборках
电子装配用附件材料第1-1部分:电子装配中高质量互连焊剂的要求
KS C IEC 61190-1-1(2016 Confirm)
전자 조립품용 부착 재료－제1－1부：전자기기 조립시 양질의 연결을 위한 땜납 플럭스의 요구사항
电子组装用连接材料第1－1部分:电子组装用高质量互连用焊剂的要求
2006-12-18
KS C IEC 61190-1-2(2016 Confirm)
전자 조립품용 부착 재료－제1－2부：전자기기 조립시 양질의 연결을 위한 땜납 페이스트의 요구사항
电子组装用连接材料第1－2部分:电子组装用高质量互连用焊膏的要求
2006-12-18
KS C IEC 61190-1-1(2021 Confirm)
전자 조립품용 부착 재료－제1－1부：전자기기 조립시 양질의 연결을 위한 땜납 플럭스의 요구사항
电子组装附件材料第1－1部分:电子组装中高质量互连用焊剂的要求
2006-12-18
KS C IEC 61190-1-2
전자 조립용 부착 재료 —제1-2부: 전자기기 조립 시 양질의 연결을 위한 솔더 페이스트의 요구사항
电子组件用连接材料.第1-2部分:电子组件中高质量互连用焊膏的要求
2021-12-02
IEC 61190-1-2-2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
电子组装附件材料 - 第1-2部分:电子组装中高质量互连焊锡膏的要求
2014-02-19
IEC 61190-1-1-2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
电子组装附件材料 - 第1-1部分:电子组装中高质量互连焊料焊剂的要求
2002-03-25
TechAmerica GEIA-STD-0005-3-REV A
Performance Testing for Aerospace and High Performance Electronic Interconnects Containing PB-free Solder and Finishes
含无铅焊料和饰面的航空航天和高性能电子互连的性能测试
2012-12-01
SAE GEIASTD0005_3A
Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes
包含无铅焊料和表面处理的航空航天和高性能电子互连的性能测试
2012-12-01
DIN EN 61190-1-1
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
电子组件用连接材料.第1-1部分:电子组件中高质量互连用焊剂的要求（IEC 61190-1-1-2002）；德文版EN 61190-1-1:2002
2003-01-01
BS EN 50157-2-1-1999
Domestic and similar electronic equipment interconnection requirements: AV. link-Signal quality matching and automatic selection of source devices
家用和类似电子设备互连要求:AV 链接信号质量匹配与源设备的自动选择
1999-03-15
DIN EN 50157-2-1
Domestic and similar electronic equipment interconnection requirements: AV.link - Part 2-1: Signal quality matching and automatic selection of source devices; German version EN 50157-2-1:1998
家用和类似电子设备互连要求:AV 链路.第2-1部分:信号质量匹配和源设备的自动选择；德文版EN 50157-2-1:1998
1999-05-01