BS PD IEC/TS 62647-22-2013
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Technical guidelines
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2013-10-31
BS PD IEC/TS 62647-2-2012
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Mitigation of deleterious effects of tin
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统 减轻锡的有害影响
2013-01-31
BS PD IEC TS 62686-2-2019
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications-General requirements for passive components
航空电子设备的过程管理 航空航天、国防和高性能（ADHP）应用电子元件
2019-02-07
GB/Z 41275.22-2023
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第22部分：技术指南
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22: Technical guidelines
2023-12-28
IEC TS 62647-22-2013
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第22部分:技术指南
2013-09-25
BS PD IEC/TS 62647-21-2013
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Program management. Systems engineering guidelines for managing the transition to lead-free electronics
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2013-08-31
BS PD IEC/TS 62647-1-2012
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Preparation for a lead-free control plan
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2012-11-30
GB/T 41275.21-2022
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第21部分：向无铅电子过渡指南
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21：Guidelines for transition to lead-free electronics
2022-03-09
BS PD IEC/TS 62647-4-2018
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Ball grid array (BGA) re-balling
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2018-04-25
IEC TS 62647-2-2012
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第2部分:减轻锡的有害影响
2012-11-29
IEC TS 62686-2-2019
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
航空电子设备的过程管理.航空航天、国防和高性能（ADHP）应用的电子元件.第2部分:无源元件的一般要求
2019-01-30
IEC TS 62647-21-2013
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第21部分:程序管理.管理向无铅电子设备过渡的系统工程指南
2013-07-26
IEC TS 62647-1-2012
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第1部分:无铅控制计划的准备
2012-08-09
BS PD IEC/TS 62647-23-2013
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2013-10-31
BS PD IEC TS 62686-1-2020
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications-General requirements for high reliability integrated circuits and discrete semiconductors
航空电子设备的过程管理 航空航天、国防和高性能（ADHP）应用电子元件
2020-04-29
BS PD IEC/TS 62647-3-2014
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Performance testing for systems containing lead-free solder and finishes
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2014-03-31
GB/Z 41275.4-2023
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array（BGA）re-balling
2023-12-28
IEC TS 62647-4-2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第4部分:球栅阵列（BGA）再成球
2018-04-10
BS PD IEC/TS 62564-1-2016
Process management for avionics. Aerospace qualified electronic components (AQEC)-Integrated circuits and discrete semiconductors
航空电子设备的过程管理 航空航天合格电子元件（AQEC）
2016-07-31
GB/Z 41275.23-2023
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分：无铅及混装电子产品返工/修复指南
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
2023-12-28