现行 GB/T 43799-2024
高密度互连印制板分规范 高密度互连印制板分规范 Sectional specification for high density interconnect printed boards
发布日期:2024-03-15
实施日期:2024-07-01
分类信息
研制信息

归口单位: 全国印制电路标准化技术委员会

起草单位: 中国电子科技集团公司第十五研究所、 莆田市涵江区依吨多层电路有限公司、 广州广合科技股份有限公司、 中国电子技术标准化研究院、 厦门市铂联科技股份有限公司

起草人: 郭晓宇、 刘胜贤、 彭镜辉、 唐瑞芳、 田玲、 曾红、 陈长生、 楼亚芬、 曹易、 吴永进

标准简介
相似标准/计划/法规
IPC 2226A
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
高密度互连(HDI)印制板的分段设计标准
2017-09-01
T/CPCA 6045-2017
高密度互连印制电路板技术规范
Specification for High Density Interconnect Printed Circuit Board
2017-10-05
SJ 21083-2016
高密度互连印制板设计要求
Design requirements for high density interconnect printed circuit boards
2016-01-19
IPC 6801
Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
Buld Up/High Density Interconnect(HDI)印制电路板的术语和定义、试验方法和设计示例
2000-01-01
BS EN 61249-3-5-1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Transfer adhesive films for flexible printed boards
互连结构材料 覆层和非覆层非增强基材分规范集(适用于柔性印制板)
1999-06-15
IEC 61249-6-3-2023
Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
印制板和其他互连结构用材料.第6-3部分:增强材料分规范集.印制板用“E”玻璃编织成品织物规范
2023-06-14
MIL DSCC 89065B
GENERAL SPECIFICATION FOR HIGH PERFORMANCE, HIGH DENSITY, TWO PIECE PRINTED CIRCUIT BOARD CONNECTOR (SUPERSEDING DESC 89065A)
高性能、高密度两件式印刷电路板连接器通用规范(取代DESC 89065A)
2003-10-01
UNE-EN 61249-3-5-2000
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
印制板和其他互连结构用材料 第3-5部分:覆层和非覆层(用于柔性印制板)无加强基材分规范集 转移胶粘膜
2000-11-21
KS C IEC 61249-3-5
인쇄기판 및 다른 내부접속 구조용 재료 — 제3-5부: (연성회로기판용) 클래드 및 언클래드 비강화 재료에 대한 단면 규격 — 전사 접착 필름
印刷板和其他互连结构材料 - 第3-5部分:非增强基材 包层和包装(用于柔性印刷板)的分段规格 - 转印胶带
2024-10-30
IEC 61249-3-5-1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
印刷板和其他互连结构材料 - 第3-5部分:非增强基材 包层和包装(用于柔性印刷板)的分段规格 - 转印胶带
1999-02-10
UNE-EN 61249-3-3-2000
Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
印制板和其他互连结构用材料第3-3部分:覆层和非覆层(用于柔性印制板)非增强基材分规范集涂有粘合剂的柔性聚酯薄膜
2000-12-04
UNE-EN 61249-3-4-2000
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
印制板和其他互连结构用材料 第3-4部分:覆层和非覆层(用于柔性印制板)无加强基材分规范集 胶粘剂涂覆柔性聚酰亚胺薄膜
2000-11-17
KS C IEC 61249-3-3
인쇄기판 및 다른 내부접속 구조용 재료 — 제3-3부: (연성인쇄기판용) 클래드 및 언클래드 비강화 재료에 대한 단면 규격 — 접착제 코팅된 연성 폴리에스테르 필름
印制板和其他互连结构用材料.第3-3部分:包覆和非包覆(柔性印制板用)无增强基材的分规范集.涂粘合剂的柔性聚酯薄膜
2024-10-30
KS C IEC 61249-3-4
인쇄기판 및 다른 내부접속 구조용 재료 — 제3-4부: (연성인쇄기판용) 클래드 및 언클래드 비강화 재료에 대한 단면 규격 — 접착제 코팅된 연성 폴리이미드 필름
印制板和其他互连结构用材料.第3-4部分:包层和非包层(用于柔性印制板)无增强基材的分规范集.涂有粘合剂的柔性聚酰亚胺薄膜
2024-10-30
IEC 61249-3-3-1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
印制板和其他互连结构用材料.第3-3部分:包覆和非包覆(柔性印制板用)无增强基材的分规范集.涂粘合剂的柔性聚酯薄膜
1999-02-10
IEC 61249-3-4-1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
印刷板和其他互连结构材料 - 第3-4部分:非增强基材 包层和包装(用于柔性印刷板)的分段规格 - 粘合剂涂层柔性聚酰亚胺膜
1999-02-10
BS EN 61249-4-1-2008
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
印制板和其他互连结构用材料
2008-07-31
BS EN 61249-3-3-1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料 包覆和未包覆的非增强基材分规范集(适用于柔性印制板) 涂有粘合剂的柔性聚酯薄膜 涂胶柔性聚酯薄膜
1999-06-15
BS EN 61076-4-1997
Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications-Sectional specification. Printed board connectors
直流、低频模拟和数字高速数据应用中使用的经质量评估的连接器
1997-03-15
KS C IEC 61249-4-1(2017 Confirm)
인쇄 회로 기판 및 기타 전자 배선용 재료-제4-1부:무동박(다층 회로 기판 제조용)프리프레그 소재의 부분 표준-규정 난연 등급의 E-유리 섬유 직조 에폭시 프리프레그
印制板和其他互连结构用材料第4-1部分:非包覆预浸料分规范(多层板制造用)规定可燃性的环氧编织E玻璃预浸料
2012-11-19
互连印制板

最后更新时间 2025-09-07