MIL MIL-STD-202-208A
TEST METHOD STANDARD, METHOD 208, SOLDERABILITY
试验方法标准 方法208 可焊性
2020-01-26
EIA/JESD 22-B102C
Test Methods and Procedures for Solid State Devices: Solderability
固态器件的试验方法和程序:可焊性
1998-09-02
ASTM B678-23
Standard Test Method for Solderability of Metallic-Coated Products
金属涂层产品可焊性的标准试验方法
2023-11-01
BS EN 2591-501-2002
Elements of electrical and optical connection. Test methods-Soft solderability
电气和光学连接元件 试验方法 软可焊性
2002-07-08
GB/T 42899-2023
海洋工程结构钢可焊性试验方法
Test method for weldability of ocean engineering structural steel
2023-08-06
GB/T 4909.12-2009
裸电线试验方法 第12部分：镀层可焊性试验-焊球法
Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method
2009-03-19
GOST 23870-1979
Свариваемость сталей. Метод оценки влияния сварки плавлением на основной металл
钢的可焊性 母金属熔焊效果评价试验方法
JIS C 0099-2005
Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
环境试验:试验——试验:用无铅焊膏润湿平衡法测定表面安装器件（SMD）可焊性的试验方法
2005-01-01
GB/T 4937.21-2018
半导体器件 机械和气候试验方法 第21部分：可焊性
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
2018-09-17
GB/T 15972.32-2021
光纤试验方法规范 第32部分：机械性能的测量方法和试验程序 涂覆层可剥性
Specifications for optical fibre test methods—Part 32： Measurement methods and test procedures for mechanical characteristics—Coating strippability
2021-10-11
JIS Z 3198-4-2003
Test methods for lead-free solders -- Part 4: Methods for solderbility test by a wetting balance method and a contact angle method
无铅焊料试验方法第4部分:润湿平衡法和接触角法的可焊性试验方法
2003-01-01
GB/T 2423.32-2008
电工电子产品环境试验 第2部分：试验方法 试验Ta: 润湿称量法可焊性
Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: Solderability test by the wetting balance method
2008-03-24
KS C 0287(2017 Confirm)
환경 시험 방법(전기ㆍ전자)－표면 실장 부품 (SMD)의 납땜성, 전극의 납땜내성, 납땜의 먹힘성 및 납땜 내열성 시험 방법
环境试验－试验－试验Td:表面安装器件（SMD）的可焊性、金属化层的耐溶解性和耐焊接热的试验方法
2002-10-07
KS C IEC 60068-2-20
환경시험 — 제2-20부: 시험 — 시험 T: 리드가 있는 소자의 땜질성 및 땜질 내열성 시험방법
环境试验.第2-20部分:试验.试验T:带引线器件的可焊性和耐焊接热的试验方法
2021-06-16
JIS C 60068-2-20-2010
Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验第2-20部分:试验T:带引线器件的可焊性和耐焊接热的试验方法
2010-01-01
KS C IEC 60068-2-20
환경 시험 — 제2-20부: 시험 — 시험 Ta 및 Tb: 리드가 있는 부품의 땜질성 및 땜질 내열성 시험방법
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法
2022-12-08
EN IEC 60068-2-20-2021
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法
2021-05-07
IEC 60068-2-20-2021 RLV
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验第2-20部分:试验Ta和Tb试验:带引线器件的可焊性和耐焊接热的试验方法
2021-03-30
IEC 60068-2-20-2021
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法
2021-03-30
UNE-EN 60068-2-58-2006
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属溶解性和耐焊接热的试验方法
2006-02-01