ECA/EIA/IS 46
TEST PROCEDURE FOR RESISTANCE TO SOLDERING (VAPOR PHASE TECNIQUE) FOR SURFACE MOUNT DEVICES
表面安装装置耐焊接性（气相技术）的试验程序
1987-07-01
KS C 0287(2017 Confirm)
환경 시험 방법(전기ㆍ전자)－표면 실장 부품 (SMD)의 납땜성, 전극의 납땜내성, 납땜의 먹힘성 및 납땜 내열성 시험 방법
环境试验－试验－试验Td:表面安装器件（SMD）的可焊性、金属化层的耐溶解性和耐焊接热的试验方法
2002-10-07
BS EN 60068-2-58-2015+A1-2018
Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境测试
2018-05-21
JIS C 0099-2005
Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
环境试验:试验——试验:用无铅焊膏润湿平衡法测定表面安装器件（SMD）可焊性的试验方法
2005-01-01
BS EN 62137-1-3-2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Cyclic drop test
表面安装技术 表面安装焊点的环境和耐久性试验方法
2009-03-31
BS EN 62137-1-1-2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Pull strength test
表面安装技术 表面安装焊点的环境和耐久性试验方法
2007-10-31
BS EN 62137-1-4-2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Cyclic bending test
表面安装技术 表面安装焊点的环境和耐久性试验方法
2009-03-31
BS EN 62137-1-2-2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Shear strength test
表面安装技术 表面安装焊点的环境和耐久性试验方法
2007-10-31
JIS C 60068-2-58-2002
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2部分:试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法
2002-01-01
BS EN 60068-2-83-2011
Environmental testing-Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
环境测试
2011-11-30
SJ/T 11200-2016
环境试验 2-58部分:试验 试验Td:表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法
Environmental testing Part 2-58:Tests Test Td:Test methods for solderability,resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
2016-04-05
BS EN 62137-1-5-2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints-Mechanical shear fatigue test
表面安装技术 表面安装焊点的环境和耐久性试验方法
2009-07-31
UNE-EN 60068-2-58-2006
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属溶解性和耐焊接热的试验方法
2006-02-01
KS C IEC 60068-2-58(2017 Confirm)
기본 환경시험 절차－제2－58부：시험－시험 Td：표면실장부품 (SMD)의 납땜성, 금속 내침식성 및 납땜 내열성 시험방법
环境试验—第2－58部分:试验—试验Td:表面贴装器件（SMD）的可焊性、耐金属溶解性和耐焊接热的试验方法
2007-11-29
KS C IEC 60068-2-58(2022 Confirm)
기본 환경시험 절차－제2－58부：시험－시험 Td：표면실장부품 (SMD)의 납땜성, 금속 내침식성 및 납땜 내열성 시험방법
环境试验－第2－58部分:试验－试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法
2007-11-29
IEC 60068-2-58-2015+AMD1-2017 CSV
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验.第2-58部分:试验.试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法
2017-07-28
IEC 60068-2-58-2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境测试 - 第2-58部分:测试 - 测试Td:可焊性测试方法 金属化溶解性和表面贴装器件焊接热阻抗（smd）
2015-03-27
SME MS910289
Assuring Reliable Surface Mounted Solder Joints
确保可靠的表面安装焊点
1991-06-01
GOST R IEC 60068-2-83-2017
Испытания на воздействие внешних факторов. Часть 2-83. Испытания. Испытание Tf: Испытание на паяемость электронных компонентов для поверхностного монтажа с использованием припойной пасты методом баланса смачивания
环境试验 第2-83部分 测试 测试Tf 通过使用焊膏的润湿平衡法对表面安装装置的电子部件进行可焊性试验
JEDEC JESD22-B108B
COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES
表面安装半导体器件的共面性测试
2010-09-01